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mc74hct245a

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MC74HCT245A Datasheet:

Description:

The MC54/74HCT245A is identical in pinout to the LS245. This device may be used as a level converter for interfacing TTL or NMOS outputs to High Speed CMOS inputs.

The MC54/74HCT245A is a 3–state noninverting transceiver that is used for 2–way asynchronous communication between data buses. The device has an active–low Output Enable pin, which is used to place the I/O ports into high–impedance states. The Direction control determines whether data flows from A to B or from B to A.
• Output Drive Capability: 15 LSTTL Loads
• TTL/NMOS Compatible Input Levels
• Outputs Directly Interface to CMOS, NMOS and TTL
• Operating Voltage Range: 4.5 to 5.5 V
• Low Input Current: 1.0 μA
• In Compliance with the Requirements Defined by JEDEC Standard No. 7A
• Chip Complexity: 304 FETs or 76 Equivalent Gates



(Absolute) Maximum Ratings:
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage (Referenced to GND)
– 0.5 to + 7.0
V
Vin
DC Input Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
Vout
DC Output Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
Iin
DC Input Current, per Pin
± 20
mA
Iout
DC Output Current, per Pin
± 35
mA
ICC
DC Supply Current, VCC and GND Pins
± 75
mA
PD
Power Dissipation in Still Air,
Plastic or Ceramic DIP†
             SOIC Package†
SSOP or TSSOP Package†

750
500
450

mW
Tstg
Storage Temperature
– 65 to+150
°C
TL

Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP, SOIC, SSOP or TSSOP Package)
(Ceramic DIP)
260
300
°C


* Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/°C from 65° to 125°C
                    Ceramic DIP: – 10 mW/°C from 100 to 125°C
                    SOIC Package: – 7 mW/°C from 65 to 125°C
 SSOP or TSSOP Package: – 6.1 mW/°C from 65 to 125°C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).



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